Quobly and CEA-Leti Strengthen Collaboration via FAMES Pilot Line to Scale 300 mm Silicon Spin-Qubit Platform

Quobly and CEA-Leti have expanded their existing collaboration through the FAMES pilot line to scale Quobly's 300 mm silicon spin-qubit platform. The roadmap includes making Quobly's Alloy Pioneer processor family available on the cloud by late 2026, and the partners are targeting a fault-tolerant silicon architecture by 2032.

AI analysis — not reported by the source

What this could mean

0–2 yearsPlausible
If the FAMES 300 mm pilot line successfully transfers Quobly's spin-qubit process, it could let Quobly use established CMOS metrology and wafer-scale test flows to iterate devices quickly enough that the late-2026 Alloy Pioneer cloud release offers repeatable multi-qubit performance instead of lab-only demonstrations.
300 mm fabrication gives access to high-throughput, statistically meaningful yield data and standard process control; silicon spin qubits are structurally similar to transistors, so the main near-term gate is manufacturability, which the pilot line is intended to resolve.

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